During semiconductor manufacturing processes, various hazardous exhaust gases are generated
Acidic Gases: Such as hydrogen chloride (HCl), hydrogen fluoride (HF), chlorine (Cl₂), etc.
Volatile Organic Compounds (VOCs): Including various organic solvent vapors.
Alkaline Gases: Such as ammonia (NH₃).
Particulate Matter: Such as silicon dust and other fine particles.
SCDRY100
Low operating costs, high treatment efficiency, and easy maintenance.
Type
Dry Scrubber
Main Application Process
IMP、厂务
Dimension
W700 * D700 * H1600 （mm）
Process Gas
PH3、AsH3、B2H6、BF3
Processing Capacity
100 LPM
SCMW600PS
Digital sensor monitoring with high stability, enhanced safety, modular design, advanced automation, and easy maintenance.
Type
Plasma Scrubber
Main Application Process
ETCH、DIFF/CVD
Dimension
W850 * D900 * H2100 （mm）
Process Gas
SiH4、CF4、TEOS、PFCs
Processing Capacity
600 LPM
SCMW600PD
Digital sensor monitoring with high stability, enhanced safety, modular design, advanced automation, and easy maintenance.
Type
Plasma Scrubber
Main Application Process
CVD、ETCH、DIFF
Dimension
W1700 * D900 * H2100 （mm）
Process Gas
PFCs、SiH4、NH3…
Processing Capacity
600 + 600 LPM
SCMW600BS
Specially engineered BURN technology effectively suppresses NOx formation, with wide applicability, broad application range, and compact footprint.
Type
Burn Wet Scrubber
Main Application Process
ETCH、DIFF/CVD
Dimension
W850 * D900 * H2100 （mm）
Process Gas
SiH4、CF4、TEOS、PFCs
Processing Capacity
600 LPM
SCMW600BD
Modular design, highly automated, easy maintenance, low operating costs, clog-resistant, and corrosion-proof construction.
Type
Burn Wet Scrubber
Main Application Process
CVD、ETCH、DIFF
Dimension
W1700 * D900 * H2100 （mm）
Process Gas
PFCs、SiH4、NH3…
Processing Capacity
600 + 600 LPM
SCMW600TS
Internal heating rod design ensures rapid heating/cooling, uniform thermal distribution, and compact footprint.
Type
Thermal Wet Scrubber
Main Application Process
ETCH、DIFF/CVD
Dimension
W850 * D900 * H2100 （mm）
Process Gas
SiH4、CF4、TEOS、PFCs
Processing Capacity
600 LPM
SCMW600TD
Compact footprint, low operating costs, modular architecture, high automation level, and maintenance-friendly design
Type
Thermal Wet Scrubber
Main Application Process
DIFF、T/F、ETCH
Dimension
W1700 * D900 * H2100 （mm）
Process Gas
SiH4、NH3、NF3、TEOS、N2O
Processing Capacity
600 + 600 LPM
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