Hazardous Exhaust Gases Generated in LCD Panel Manufacturing Process
Volatile Organic Compounds (VOCs): Benzene, toluene, xylene, etc.
Particulate Matter: Fine particles such as dust and silicon powder.
Acidic Gases: Hydrogen fluoride (HF), hydrogen chloride (HCl), etc.
SCPW3000N
Digital sensor monitoring with high stability, enhanced safety, modular design, advanced automation, and easy maintenance.
Type
Plasma Scrubber
Main Application Process
FPD
Dimension
W1450 * D1300 * H2000 （mm）
Process Gas
H2、SiH4、CF4、TEOS、PFCs
High-capacity hydrogen processing solution
400 LPM
SCDRY100
Low operating costs, high treatment efficiency, and easy maintenance.
Type
Dry Scrubber
Main Application Process
IMP、厂务
Dimension
W700 * D700 * H1600 （mm）
Process Gas
PH3、AsH3、B2H6、BF3
Processing Capacity
100 LPM
SCPW1500
Extended lifespan plasma torch, energy-efficient high-performance plasma technology, clog-resistant, and corrosion-proof design.
Type
Plasma Scrubber
Main Application Process
ETCH、DIFF/CVD
Dimension
Process Gas
SiH4、CF4、TEOS、PFCs
Processing Capacity
1500 LPM
SCBW1500
Specially engineered BURN technology effectively suppresses NOx formation, with wide applicability, broad application range, and compact footprint.
Type
Burn Wet Scrubber
Main Application Process
ETCH、DIFF/CVD
Dimension
W1200 * D1000 * H1900 （mm）
Process Gas
SiH4、CF4、TEOS、PFCs
Processing Capacity
1500 LPM
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