Key Process Gases in Semiconductor Manufacturing
CVD:SiH₄ (Silane)、C₃H₈ (Propane)、H₂ (Hydrogen)
ETCH:CF₄ (Carbon Tetrafluoride)、Cl₂ (Chlorine)、BCl₃ (Boron Trichloride)
EPI&MOCVD:NH₃ (Ammonia)、H₂ (Hydrogen)、AsH₃ (Arsine)、TMGa (Trimethylgallium)、TEGa (Triethylgallium)etc.
IMP:B₂H₆ (Diborane)、PH₃ (Phosphine)
SCPW3000N
Digital sensor monitoring with high stability, enhanced safety, modular design, advanced automation, and easy maintenance.
Type
Plasma Scrubber
Main Application Process
MOCVD、EPI、SIC、SOLAR
Dimension
W1450 * D1300 * H2000 （mm）
Process Gas
H2、SiH4、CF4、TEOS、PFCs
High-capacity hydrogen processing solution
400 LPM
SCPW3000H
Dual-Torch Head（High-capacity hydrogen processing solution）、Plasma torch with Ultra-Long Service Life、High-Efficiency Plasma with Low Energy Consumption
Type
Plasma Scrubber
Main Application Process
EPI、CVD、DIFF
Dimension
W1700 * D900 * H2100 （mm）
Process Gas
H2、TEOS、WF6、CF4、PFC Etc.
Processing Capacity
3000 LPM
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